MediaTek Dimensity 9000. (MediaTek) – MediaTek has revealed the Dimensity 9000 flagship chipset some time ago. The latest leak claims that MediaTek Dimensity 9000 could be coming to flagship phones in the first quarter of 2022 (Q1 2022). Based on a leak from a leaker on Weibo, the first HP with Dimensity 9000 could be launched in the range of February next year. If production goes according to plan, we can see firsthand devices with MediaTek’s fast chipsets in early 2022. Please note, MediaTek has actually stolen the start before Qualcomm. Even so, the commercial release of the device is predicted to be held by Qualcomm. The flagship cellphone equipped with Snapdragon 8 Gen1 is expected to be ready to launch this year. Quoted from GSMArena, Xiaomi 12 with Snapdragon 8 Gen1 chipset is expected to debut in December 2021. CPU configuration of MediaTek Dimensity 9000. (MediaTek) Towards the MediaTek Annual Summit, the company has previously showcased the features of Dimensity 9000. They claim that this is a chipset with a system the most technically advanced 4 nm fabrication. MediaTek’s Vice President of Corporate Marketing, Finbarr Moynihan explained the advantages of the Dimensity 9000 and discussed its competitors. The chipset is the first product to use an ARM Cortex X2 core based on the ARM V9 architecture. The Dimensity 9000 has an octa-core CPU configured with one Cortex X2 core (3.05 GHz clock speed) + three Cortex A710 cores (2.85 GHz clock speed) + four Cortex A510 cores (1.8 GHz). The Dimensity 9000 5G. (MediaTek) VP MediaTek claims that their flagship chipset can rival or match the Apple A15 Bionic in multi-core benchmark tests. They also boast a Dimensity 9000 score which is able to break the AnTuTu score of 1 million points. A leak from a leaker also reveals that the Snapdragon 8 Gen1 could hit the AnTuTu benchmark score of 1 million points. Regarding graphics, the MediaTek Dimensity 9000 is the first chip to use the Mali G710 Graphics Processing Unit (GPU). Mediatek’s AI Processing Unit (APU) has been upgraded with four high-performance cores and two flexible-performance cores. .

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